UCSP Applications Information

For the latest application details on UCSP construction,

dimensions, tape carrier information, printed circuit board

techniques, bump-pad layout, and recommended reflow

temperature profile, as well as the latest information on

reliability testing results, refer to the application note,

“UCSP—A Wafer-Level Chip-Scale Package” available

on Maxim’s web site at http://www.maxim-ic.com/ucsp.

UCSP Marking Information

Pin A1 Bump Indicator

AAA: Product ID code

XXX: Lot Code

Chip Information

TRANSISTOR COUNT: 4877

PROCESS: BiCMOS

Low-Cost, Mono, 1.4W BTL Audio Power

Amplifiers

______________________________________________________________________________________

13

Selector Guide

PART

BTL/SE INPUT

GAIN (dB)

MAX9716

—

Adjustable

MAX9717A

√

Adjustable

MAX9717B

√

6

MAX9717C

√

9

MAX9717D

√

12

Ordering Information (continued)

PART

TEMP RANGE

PIN-

PACKAGE

GAIN

(dB)

MAX9717AEBL-T*

-40°C to +85°C

3 x 3 UCSP

Adj.

MAX9717AETA

-40°C to +85°C

8 TDFN-EP**

Adj.

MAX9717AEUA

-40°C to +85°C

8 µMAX-EP**

Adj.

MAX9717BEBL-T*

-40°C to +85°C

3 x 3 UCSP

6

MAX9717BETA

-40°C to +85°C

8 TDFN-EP**

6

MAX9717BEUA

-40°C to +85°C

8 µMAX-EP**

6

MAX9717CEBL-T*

-40°C to +85°C

3 x 3 UCSP

9

MAX9717CETA

-40°C to +85°C

8 TDFN-EP**

9

MAX9717CEUA

-40°C to +85°C

8 µMAX-EP**

9

MAX9717DEBL-T*

-40°C to +85°C

3 x 3 UCSP

12

MAX9717DETA

-40°C to +85°C

8 TDFN-EP**

12

MAX9717DEUA

-40°C to +85°C

8 µMAX-EP**

12

AAA

XXX

*Future product—contact factory for availability.

**EP = Exposed paddle.