IX4340

R05

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3

1

Specifications

1.1 Pin Configuration

1.2 Logic Table

1.3 Pin Definitions

1.4 Absolute Maximum Ratings

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.

Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not

implied.

ENA

INA

GND

INB

ENB

OUTA

V

CC

OUTB

1

2

3

4

8

7

6

5

A

B

IXx

ENx

OUTx

11

1

01

0

x0

0

xx

0

Pin #

Name Description

1ENA

Enable input for Channel A. A logic high (or floating) enables Channel A (the state of OUTA is determined by INA). A logic

low disables OUTA (OUTA held low regardless of INA).

2

INA

Channel A logic input. Internally pulled to GND.

3

GND

Ground. Common ground reference for the device.

4

INB

Channel B logic input. Internally pulled to GND.

5

OUTB Channel B output, capable of sourcing and sinking 5A

6

Supply Voltage.

7

OUTA

Channel A output, capable of sourcing and sinking 5A

8ENB

Enable input for Channel B. A logic high (or floating) enables Channel B (the state of OUTB is determined by INB). A logic

low disables OUTB (OUTB held low regardless of INB).

The thermal pad on the bottom of the thermally enhanced devices, IX4340NE and IX4340UE, may be connected to GND or left floating;

it must not be connected to any other net. The thermal pad is not intended to carry current.

Parameter

Symbol

Minimum

Maximum

Units

Supply Voltage

-0.3

20

V

Input Voltage

-0.3

20

V

Output Current

-±5

A

ESD Rating (Human Body Model)

-4000

+4000

V

Junction Temperature

-55

+150

°C

Storage Temperature

-65

+150

°C