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TLV3501AIDBVT 数据表(PDF) 2 Page - Texas Instruments

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部件名 TLV3501AIDBVT
功能描述  4.5ns Rail-to-Rail, High-Speed Comparator in Microsize Packages
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

TLV3501AIDBVT 数据表(HTML) 2 Page - Texas Instruments

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TLV3501
TLV3502
SBOS321D − MARCH 2005 − REVISED JULY 2005
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage
+5.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals, Voltage(2)
(V−) − 0.3V to (V+) + 0.3V
. . . . .
Signal Input Terminals, Current(2)
10mA
. . . . . . . . . . . . . . . . . . . . .
Output Short Circuit(3)
74mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature
−40
°C to +125°C
. . . . . . . . . . . . . . . . . . . . .
Storage Temperature
−65
°C to +150°C
. . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature
+150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s)
+300
°C
. . . . . . . . . . . . . . . . . . . .
ESD Rating (Human Body Model)
3000V
. . . . . . . . . . . . . . . . . . . .
Charged-Device Model (CDM)
500V
. . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.3V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground, one comparator per package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TLV3501
SOT23-6
DBV
NXA
TLV3501
SOT23-6
DBV
NXA
TLV3501
SO-8
D
TLV3501A
TLV3501
SO-8
D
TLV3501A
TLV3502
SOT23-8
DCN
NXC
TLV3502
SOT23-8
DCN
NXC
TLV3502
SO-8
D
TLV3502A
TLV3502
SO-8
D
TLV3502A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
(1) Pin 1 of the SOT23-6 is determined by orienting the package marking as indicated on the diagram.
(2) NC indicates no internal connection.
1
2
3
6
5
4
SHDN
OUT
V+
TLV3501
SOT23−6(1)
−IN
V
+IN
1
2
3
4
8
7
6
5
SHDN
V+
OUT
NC(2)
NC(2)
−IN
+IN
V
TLV3501
SO−8
1
2
3
4
8
7
6
5
V+
OUT A
OUT B
V
TLV3502
SOT23−8, SO−8
+IN A
−IN A
+IN B
−IN B
A
B



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