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TPS1663

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SLVSET9A – SEPTEMBER 2018 – REVISED OCTOBER 2018

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11 Layout

11.1 Layout Guidelines

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For all the applications, a 0.1 µF or higher value ceramic decoupling capacitor is recommended between IN

terminal and GND.

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High current carrying power path connections must be as short as possible and must be sized to carry at

least twice the full-load current. See Figure 19 and Figure 20 for a typical PCB layout example.

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their connection pin. Connect the other end of the component to the GND with shortest trace length.

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effects on the current limit and current monitoring accuracy. These traces must not have any coupling to

switching signals on the board.

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Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the

device they are intended to protect, and routed with short traces to reduce inductance. For example, a

protection Schottky diode is recommended to address negative transients due to switching of inductive loads,

and it must be physically close to the OUT and GND pins.

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Thermal Considerations: When properly mounted, the PowerPAD package provides significantly greater

cooling ability. To operate at rated power, the PowerPAD must be soldered directly to the board GND plane

directly under the device. Other planes, such as the bottom side of the circuit board can be used to increase

heat sinking in higher current applications.