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L4120G-AB5-R 数据表(PDF) 3 Page - Unisonic Technologies |
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L4120G-AB5-R 数据表(HTML) 3 Page - Unisonic Technologies |
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3 / 4 page ![]() L4120 CMOS IC UNISONICTECHNOLOGIESCO.,LTD 3 of 4 www.unisonic.com.tw QW-R125-031.C ABSOLUTE MAXIMUM RATING PARAMETER SYMBOL RATINGS UNIT Input Voltage VIN -0.3~+40 V VIN≥5V VIN+0.3~VIN-5 V ISENSE Voltage VIN<5V VISENSE VIN+0.3~ -0.3 V LX Output Voltage VLX -0.3~+40 V Adjust Pin Input Voltage VADJ -0.3~+6 V Switch Output Current ILX 1.5 A Power Dissipation PD 0.5 W Junction Temperature TJ 150 °C Operating Temperature TOP -40~105 °C Storage Temperature TSTG -55~150 °C Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied. THERMAL DATA PARAMETER SYMBOL RATINGS UNIT Junction to Ambient θJA 180 °C/W ELECTRICAL CHARACTERISTICS (VIN=12V, TAMB=25°C unless otherwise stated) (Note 1) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Input Voltage VIN 6 40 V Quiescent Supply Current with Output Off IINQoff ADJ Pin Grounded 400 μA Quiescent Supply Current with Output Switching IINQon ADJ Pin Floating 1000 μA Mean Current Sense Threshold Voltage VSENSE 115 mV Sense Threshold Hysteresis VSENSEHYS ±15 % External Control Voltage Range On ADJ Pin for DC Brightness Control VADJ 0.3 1.2 V DC Voltage On ADJ Pin to Switch Chip from Active (On) State to Quiescent (Off) State VADJoff VADJ Falling 0.15 0.2 0.25 V DC Voltage On ADJ Pin to Switch Chip from Quiescent (Off) State to Active (On) State VADJon VADJ Rising 0.2 0.25 0.3 V Resistance Between ADJ Pin and VREF RADJ 500 KΩ Continuous LX Switch Current ILXmean 1.2 A LX Switch “On” Resistance RLX 0.4 Ω LX Switch Leakage Current ILX(leak) 1 μA Minimum Switch “ON” Time TONmin LX Switch “ON” 200 ns Minimum Switch “OFF” Time TOFFmin LX Switch “OFF” 200 ns Typical Dimming Ratio Ddim F=100Hz, VIN=15V, 1LED, L=27μH 1200:1 Recommended Maximum Operating Frequency fLXmax 1 MHz Recommended Duty Cycle Range of Output Switch at fLXmax DLX 0.3 0.7 0.9 Internal Comparator Propagation Delay TPD 50 ns Thermal Shutdown Temperature TSD 150 °C Thermal Shutdown Hysteresis TSD-HYS 20 °C Note: Production testing of the chip is performed at 25°C. Functional operation of the chip and parameters specified are guaranteed by design, characterization and process control in other temperature. |
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