CS1087

http://onsemi.com

2

MAXIMUM RATINGS*

Parameter

Value

Unit

–0.6 to +18

V

–0.6 to +6.0

V

Junction Temperature Range

–40 to +150

°C

Storage Temperature Range

–55 to +150

°C

ESD Susceptibility (Human Body Model)

2.0

kV

ESD Susceptibility (Machine Model)

200

V

Package Thermal Resistance, DIP–40

20

45

°C/W

°C/W

Package Thermal Resistance, PLCC–44

16

55

°C/W

°C/W

Package Thermal Resistance, SO–28L

15

75

°C/W

°C/W

Lead Temperature Soldering:

Wave Solder (through hole styles only) Note 1

Reflow (SMD styles only) Note 2

260 Peak

230 Peak

°C

1. 10 second maximum.

2. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

Parameter

Test Conditions

Min

Typ

Max

Unit

–

8.0

–

16.5

V

–

2.0

5.0

mA

Reset Mode

All outputs forced low.

–

6.5

7.5

V

–

–

–

1.6

V

–

3.3

–

–

V

–

7.5

20.0

µA

GREN Input

–

–

–

1.6

V

–

3.3

–

–

V

–

30

60

µA

GRID1, GRID2, GRID3 Outputs

Sink Current

1.0

–

–

mA

Source Current

50

–

–

mA

–

–

0.5

V

–

V

3. Designed to meet these characteristics over the stated voltage and temperature ranges, though may not be 100% parametrically tested

in production.