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PAM8303CBSC 数据表(PDF) 3 Page - Diodes Incorporated |
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PAM8303CBSC 数据表(HTML) 3 Page - Diodes Incorporated |
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3 / 16 page ![]() PAM8303C Document number: DS36438 Rev.2 - 2 3 of 16 www.diodes.com May 2018 © Diodes Incorporated PAM8303C Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) The following parameters are stress ratings only, and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods can affect device reliability. All voltages are with respect to ground. Parameter Rating Unit Supply Voltage 6.0 V Input Voltage -0.3 to VDD +0.3 Maximum Junction Temperature 150 °C Storage Temperature -65 to +150 Soldering Temperature +250, 10 sec Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Parameter Rating Unit Supply Voltage Range 2.8 to 5.5 V Ambient Temperature Range -40 to +85 °C Junction Temperature Range -40 to +125 °C Thermal Information (Note 4) Parameter Package Symbol Max Unit Thermal Resistance (Junction to Ambient) MSOP-8 ϴJA 180 °C/W DFN3030-8 47.9 Thermal Resistance (Junction to Case) MSOP-8 ϴJC 75 Note: 4. For the 9-pin CSP package, the thermal resistance is highly dependent on the PCB heat sink area. For example, the ϴja can equal to 195°C/W with 50mm 2 total area or 135°C/W with 500mm2 area. When using ground and power planes, the value is approximately 90°C/W. |
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