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TLV9001UIDBVR 数据表(PDF) 38 Page - Texas Instruments |
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TLV9001UIDBVR 数据表(HTML) 38 Page - Texas Instruments |
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38 / 70 page  *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV9001IDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TLV9001IDCKR SC70 DCK 5 3000 190.0 190.0 30.0 TLV9001IDPWR X2SON DPW 5 3000 205.0 200.0 33.0 TLV9001SIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0 TLV9001TIDCKR SC70 DCK 5 3000 190.0 190.0 30.0 TLV9001UIDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0 TLV9002IDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TLV9002IDGKT VSSOP DGK 8 250 366.0 364.0 50.0 TLV9002IDR SOIC D 8 2500 336.6 336.6 41.3 TLV9002IDSGR WSON DSG 8 3000 210.0 185.0 35.0 TLV9002IDSGT WSON DSG 8 250 210.0 185.0 35.0 TLV9002IPWR TSSOP PW 8 2000 366.0 364.0 50.0 TLV9004IDR SOIC D 14 2500 336.6 336.6 41.3 TLV9004IPWR TSSOP PW 14 2000 366.0 364.0 50.0 TLV9004IRTER WQFN RTE 16 3000 367.0 367.0 35.0 TLV9004SIRTER WQFN RTE 16 3000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2018 Pack Materials-Page 2 |
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