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USL3531KG-S08-R 数据表(PDF) 5 Page - Unisonic Technologies

部件名 USL3531KG-S08-R
功能描述  NON-ISOLATED BUCK OFFLINE LED DRIVER
PDF  6 Pages
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制造商  UTC [Unisonic Technologies]
网页  http://www.utc-ic.com
标志 UTC - Unisonic Technologies

USL3531KG-S08-R 数据表(HTML) 5 Page - Unisonic Technologies

  USL3531KG-S08-R Datasheet HTML 1Page - Unisonic Technologies USL3531KG-S08-R Datasheet HTML 2Page - Unisonic Technologies USL3531KG-S08-R Datasheet HTML 3Page - Unisonic Technologies USL3531KG-S08-R Datasheet HTML 4Page - Unisonic Technologies USL3531KG-S08-R Datasheet HTML 5Page - Unisonic Technologies USL3531KG-S08-R Datasheet HTML 6Page - Unisonic Technologies  
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USL3531K
Preliminary
CMOS IC
UNISONICTECHNOLOGIESCO.,LTD
5 of 6
www.unisonic.com.tw
QW-R125-052 .a
APPLICATION INFORMATION (Cont.)
Protection Function
The UTC USL3531K offers rich protection functions to improve the system reliability, including LED open/short
protection, CS resistor short protection, VCC under voltage protection, thermal regulation.
When the LED short circuit is detected, the system works at low frequency (about 5kHz), and the CS pin turn off
threshold is reduced to 200mV. So the system power consumption is very low. At some catastrophic fault condition,
such as CS resistor shorted or inductor saturated, the internal fast fault detection circuit will be triggered, the system
stops switching immediately.
After the system enters into fault condition, the VCC voltage will decrease until it reaches the UVLO threshold,
then the system will re-start again. If the fault condition is removed, the system will recover to normal operation.
Thermal Regulation
The UTC USL3531K integrates thermal regulation function. When the system is over temperature, the output
current is gradually reduced; the output power and thermal dissipation are also reduced. The system temperature is
regulated and the system reliability is improved. The thermal regulation temperature is set to 150°C internally.
PCB Layout
The following rules should be followed in UTC USL3531K PCB layout:
Bypass Capacitor
The bypass capacitor on VCC pin should be as close as possible to the VCC Pin and GND pin.
TEST Pin
The TEST Pin should be floating or connected to GND (pin1).
Ground Path
The power ground path for current sense should be short, and the power ground path should be separated from
small signal ground path before connecting to the negative node of the bulk capacitor.
The Area of Power Loop
The area of main current loop should be as small as possible to reduce EMI radiation, such as the inductor, the
power MOSFET, the output diode and the bus capacitor loop.
NC pin
The NC pin should be connected to GND (pin1).
Drain Pin
To increase the copper area of DRAIN pin for better thermal dissipation. However too large copper area may
compromise EMI performance.



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