4.0

(.157)

11.5 ± 0.1

(.453 ± .004)

24.0 ± 0.3

(.945 ± .012)

200

(7.874)

NO COMPONENT

16.0 ± 0.1

(.630 ± .004)

COMPONENTS

NO COMPONENT

400

(15.748)

DIMENSIONS:

MM

(INCHES)

USER DIRECTION OF FEED

QTY: 300 PCS. PER REEL

10.0 ± 0.1

(.394 ± .004)

0.50 ± 0.05

(.020 ± .002)

12.5 ± 0.1

(.492 ± .004)

11.55 ± 0.1

(.455 ± .004)

Packaging Specifications

09/18

Specificationsaresubjecttochangewithoutnotice.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

USER DIRECTION OF FEED

0.50±0.05

(.020±.002)

4.0

(.157)

11.55±0.1

(.455±.004)

11.5±0.1

(.453±.004)

24.0±0.3

(.945±.012)

12.5±0.1

(.492±.004)

10.0±0.1

(.394±.004)

16.0±0.1

(.630±.004)

200

(7.874) ormore

Chipcavity

400

(15.748) ormore

24.4+2/-0

(.961+.079/-0)

2.0±0.5

(.079±.020)

100.0±2.0

(3.937±.079)

330

(12.99)DIA.

13+0.5/-0.2

(.512+.020/-.008)

DIA.

13+0.5/-0.2

(.512+.020/-.008)

DIA.

24

(.945)

Blankportions

Soldering Profile

25

Time (Seconds)

REFLOW TIMES: 3 MAX.

150

200

217

tp (245 °C / 20~40 seconds)

TP (260 °C / 10 seconds max.)

PRE-HEATING

SOLDERING

NATURAL

COOLING

60 ~ 150 seconds

60 ~ 180 seconds

480 seconds max.