NICHIA STS-DA1-4490B <Cat.No.170321>

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(3) Handling Precautions

● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics:

it might cause the LED to be deformed and/or the bump to break, which will cause the LED not to illuminate.

● When handling the product with tweezers, be careful not to apply excessive force to the resin.

Otherwise, The resin can be cut, chipped, delaminate or deformed, causing bump-bond breaks and catastrophic failures.

● Dropping the product may cause damage.

● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,

delaminated and/or deformed. It may cause bump to break, leading to catastrophic failures.

(4) Design Consideration

● PCB warpage after mounting the products onto a PCB can cause the package to break.

The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.

● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.

The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.

● Board separation must be performed using special jigs, not using hands.

● If an aluminum PCB is used, customer is advised to verify the PCB with the products before use.

Thermal stress during use can cause the solder joints to crack.

● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, packing,

adhesive, secondary lens, lens cover, etc.) may penetrate LED lens and/or internal pre-coating resin.

If the LEDs are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed

to heat and/or photon energy and it may greatly reduce the LED light output and/or cause a color shift.

In this case, ventilating the environment may improve the reduction in light output and/or color shift.

Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues,

especially if the LEDs are planned to be used in a hermetically sealed environment.

(5) Electrostatic Discharge (ESD)

● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.

When handling the products, the following measures against electrostatic discharge are strongly recommended:

Eliminating the charge

Grounded wrist strap, ESD footwear, clothes, and floors

Grounded workstation equipment and tools

ESD table/shelf mat made of conductive materials

● Ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and

that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs,

protection against surge voltages should also be used.

● If tools or equipment contain insulating materials such as glass or plastic,

the following measures against electrostatic discharge are strongly recommended:

Dissipating static charge with conductive materials

Preventing charge generation with moisture

Neutralizing the charge with ionizers

● The customer is advised to check if the LEDs are damaged by ESD

when performing the characteristics inspection of the LEDs in the application.

Damage can be detected with a forward voltage measurement or a light-

up test at low current (≤1mA).

● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current.