4

IXD611

IXYS reserves the right to change limits, test conditions, and dimensions.

Symbol

Definition

Min

Max

Units

V

HS

High side floating supply offset voltage

-200

650

V

V

CH

High side floating absolute voltage

-0.3

35

V

V

HGO

High side floating output voltage

V

V

V

V

CL

Low side fixed supply voltage

-0.3

35

V

V

LGO

Low side output voltage

-0.3

V

V

V

DG

Logic supply offset voltage (P7, S7 only)

V

V

V

V

IN

Logic input voltage(HIN & LIN)

LS - 0.3

V

V

dV

Allowable offset supply voltage transient

50

V/ns

P

D

Package power dissipation@ T

8 pin PDIP

1.0

W

8 pin SOIC

0.625

W

14 pin PDIP

1.6

W

14 pin SOIC

1.0

W

R

THJA

Thermal resistance, junction-to-ambient

8 pin PDIP

125

8 pin SOIC

200

14 pin PDIP

75

14 pin SOIC

120

T

J

Junction Temperature

150

T

S

Storage temperature

-55

150

T

L

Lead temperature (soldering, 10 s)

300

Absolute Maximum Ratings

Recommended Operating Conditions

Symbol

Definition

Min

Max

Units

V

HS

High side floating supply offset voltage

-200

600

V

V

CH

High side floating supply absolute voltage

10

30

V

V

HGO

High side floating output voltage

V

HS

V

CH

V

V

CL

Low side fixed supply voltage

10

30

V

V

LGO

Low side output voltage

0

V

CL

V

V

DG

Logic supply offset voltage (P7, S7 only)

V

V

V

V

IN

Logic input voltage(HIN, LIN)

V

V

CL

V

T

A

Ambient Temperature

-40

125