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IXRFD615 数据表(PDF) 2 Page - IXYS Corporation |
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IXRFD615 数据表(HTML) 2 Page - IXYS Corporation |
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2 / 8 page ![]() 15 A Low-Side RF MOSFET Driver IXRFD615 2 Absolute Maximum Ratings Electrical Characteristics Unless otherwise noted, TA = 25° C, 8V < VCC < 30V. All voltage measurements with respect to GND. IXRFD615 configured as described in Test Conditions. Symbol Parameter Test Conditions Typ Max Units Min VIH High input voltage 8V ≤ VCC ≤ 18V V 3.5 VIL Low input voltage 8V ≤ VCC ≤ 18V 0.8 V VHYS Input hysteresis 0.25 V VIN Input voltage range VCC + 0.3 V -5 IIN Input current 0V≤ VIN ≤VCC 10 µA -10 VOH High output voltage V VCC - 0.025 VOL Low output voltage 0.025 V ROH High output resistance VCC = 15V IOUT = 100mA 0.42 Ω ROL Low output resistance VCC = 15V IOUT = 100mA 0.22 Ω IPEAK Peak output current VCC = 15V 15 A IDC Continuous output current Limited by package power dissipation 2.5 A tR Rise time VCC=15V CL=1nF CL=2nF 4 5 ns ns tF Fall time VCC =15V CL=1nF CL=2nF 4 5.5 ns ns tONDLY ON propagation delay VCC =15V CL=2nF 25 ns tOFFDLY OFF propagation delay VCC =15V CL=2nF 22 ns PWmin Minimum pulse width FWHM VCC =15V CL=1nF 8 ns VCC Power supply voltage Recommended 8 15 18 V ICC Power supply current VCC = 15V, VIN = 0V VCC = 15V, VIN = 3.5V VCC = 15V, VIN = VCC 0.4 3.8 0.4 1 5 1 mA mA mA Parameter Value Supply Voltage VCC 30V Input Voltage Level VIN -5V to VCC + 0.3V All Other Pins -0.3V to VCC +0.3V Power Dissipation TA (AMBIENT) ≤ 25C TC (CASE) ≤ 25C 2W 100W Note: 1 Storage Temperature -40°C to 150°C Soldering Lead Temperature (10 seconds maximum) 300°C Note: Operating the device outside of the “Absolute Maximum Rat- ings” may cause permanent damage. Typical values indicate conditions for which the device is intended to be functional but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum conditions for extended periods may impact device reliability. Note: 1- Limited by high frequency performance, not package dissipa- tion. CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling. All specifications are subject to change at any time without notice. Parameter Value Maximum Junction Temperature 150°C Operating Temperature Range -40°C to 85° C Thermal Impedance (Junction to Case) RӨJC 0.25° C/W Moisture Sensitivity Level (MSL) 1 |
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