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IC-HTG 数据表(PDF) 4 Page - IC-Haus GmbH |
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IC-HTG 数据表(HTML) 4 Page - IC-Haus GmbH |
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4 / 40 page ![]() prel imin ary prel imin ary iC-HTG POWER CW LASER DIODE DRIVER Rev A1, Page 4/40 PACKAGING INFORMATION QFN24 4 mm x 4 mm to JEDEC PIN CONFIGURATION QFN24 4 mm x 4 mm (topview) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 TP PIN FUNCTIONS No. Name Function 1 NCHK Check output, active low 2 NSTBY Standby input, active low 3 NCS/A1 Chip Select, active low / I2C Ad- dress bit 1 4 ID I2C address bit 2 5 EC Enable Channel input 6 MOSI/A0 SPI Master Out Slave In / I2C Ad- dress Bit 0 7 SCLK/SCL SPI Clock / I2C Clock 8 MISO/SDA SPI Master In Slave OUT / I2C Data 9 ANIN Analog input for ADC 10 MCH Current monitor high side 11 MCL Current monitor low side 12 MOD Analog modulation 13 CI Integration Capacitor high side 14 CIL Integration Capacitor low side 15 VRN N transistor regulation 16 VRP P transistor regulation 17 VBL Channel supply 18 MD Monitor diode 19 MR Monitor resistor 20 GND Ground 21 DCO DC/DC converter trimmer 22 INS I2C or SPI selection input 23 VDD 3.3 V output supply 24 VB Power supply BP(TP) Backside Paddle (GND) 1) IC top marking: <P-CODE> = product code, <A-CODE> = assembly code (subject to changes). 1) Connecting the backside paddle is recommended by a single link to GND. A current flow across the paddle is not permissible. |
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