SSB44

Taiwan Semiconductor

2

Version:A1705

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

23

°C/W

Junction-to-ambient thermal resistance

82

°C/W

Junction-to-case thermal resistance

24

°C/W

Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

0.40

-

V

0.46

0.50

V

0.31

-

V

0.41

0.45

V

(2)

-

200

µA

-

40

mA

Junction capacitance

235

-

pF

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

SSB44

(Note 1)

H

R5

G

SMB

850 / 7" Plastic reel

R4

SMB

3,000 / 13" Paper reel

M4

SMB

3,000 / 13" Plastic reel

Note:

1. Whole series with green compound (halogen-free)

EXAMPLE P/N

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

SSB44HR5G

SSB44

H

R5

G

AEC-Q101 qualified

Green compound