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LMV331G-AL5-R 数据表(PDF) 4 Page - Unisonic Technologies

部件名 LMV331G-AL5-R
功能描述  SINGLE GENERAL PURPOSE, LOW VOLTAGE, SMALL PACK COMPARATORS
PDF  6 Pages
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制造商  UTC [Unisonic Technologies]
网页  http://www.utc-ic.com
标志 UTC - Unisonic Technologies

LMV331G-AL5-R 数据表(HTML) 4 Page - Unisonic Technologies

  LMV331G-AL5-R Datasheet HTML 1Page - Unisonic Technologies LMV331G-AL5-R Datasheet HTML 2Page - Unisonic Technologies LMV331G-AL5-R Datasheet HTML 3Page - Unisonic Technologies LMV331G-AL5-R Datasheet HTML 4Page - Unisonic Technologies LMV331G-AL5-R Datasheet HTML 5Page - Unisonic Technologies LMV331G-AL5-R Datasheet HTML 6Page - Unisonic Technologies  
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LMV331
LINEAR INTEGRATED CIRCUIT
UNISONIC TECHNOLOGIES CO., LTD
4 of 6
www.unisonic.com.tw
QW-R104-006.C
5 V DC ELECT RI CAL CH ARACT ERI ST I CS
(All limits guaranteed for TJ=25
˚C, V+=5V, V−=0V, Unless otherwise specified. Boldface limits apply at the
temperature extremes.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
(Note 2)
MAX
(Note 3)
UNIT
Input Offset Voltage
VOS
1.7
7
mV
Input Offset Voltage Average Drift
TCVOS
5
µV/
˚C
Input Bias Current
IB
25
250
nA
Input Offset Current
IOS
2
50
nA
Input Voltage Range
VCM
-0.1
V
4.2
V
Voltage Gain
AV
20
50
V/mV
Saturation Voltage
VSAT
Isink
≤4mA
200
400
mV
Output Sink Current
IO
VO
≤1.5V
10
84
mA
Supply Current
IS
60
120
µA
Output Leakage Current
0.003
1
µA
5 V AC ELECT RI CAL CH ARACT ERI ST I CS (TJ=25˚C, V+=5V, RL=5.1kΩ, V−=0V.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
(Note 2)
MAX
UNIT
Propagation Delay (High to Low)
tPHL
Input Overdrive=10mV
600
ns
Input Overdrive=100mV
200
ns
Propagation Delay (Low to High)
tPLH
Input Overdrive=10mV
450
ns
Input Overdrive=100mV
300
ns
Notes: 1. The maximum power dissipation is a function of TJ(max),
θJA, and TA. The maximum allowable power
dissipation at any ambient temperature is PD=(TJ(max)-TA)/
θJA. All numbers apply for packages soldered
directly into a PC board.
2. Typical Values represent the most likely parametric norm.
3. All limits are guaranteed by testing or statistical analysis.



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