Data Sheet

DAC08

Rev. D | Page 5 of 21

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Operating Temperature

DAC08AQ, DAC08Q

−55°C to +125°C

DAC08HQ, DAC08EQ, DAC08CQ

0°C to +70°C

DAC08CP, DAC08CS

−40°C to +85°C

−65°C to +150°C

Storage Temperature Q Package

−65°C to +150°C

Storage Temperature P Package

−65°C to +125°C

Lead Temperature (Soldering, 60 sec)

300°C

V+ Supply to V− Supply

36 V

Logic Inputs

V− to V− + 36 V

V− to V+

4.25 mA

V− to V+

Reference Input Differential Voltage

±18 V

5.0 mA

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

specified for device in socket for CERDIP, PDIP, and LCC

board for SOIC package.

Table 4. Thermal Resistance

Package Type

Unit

16-Lead CERDIP (Q)

100

16

°C/W

16-Lead PDIP (P)

82

39

°C/W

20-Terminal LCC (RC)

76

36

°C/W

16-Lead SOIC (S)

111

35

°C/W

ESD CAUTION