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THVD1419, THVD1429

SLLSF32B – NOVEMBER 2018 – REVISED DECEMBER 2018

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(1)

The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Supply voltage

3

5.5

V

Input voltage at any bus terminal

-12

12

V

High-level input voltage (driver, driver

enable, and receiver enable inputs)

2

V

Low-level input voltage (driver, driver

enable, and receiver enable inputs)

0

0.8

V

Differential input voltage

-12

12

V

Output current, driver

-60

60

mA

Output current, receiver

-8

8

mA

Differential load resistance

54

Ω

Signaling rate: THVD1419

250

kbps

Signaling rate: THVD1429

20

Mbps

Operating ambient temperature

-40

125

℃

Junction temperature

-40

150

℃

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Thermal Information

THVD14x9

UNIT

D (SOIC)

8-PINS

Junction-to-ambient thermal resistance

120.7

°C/W

Junction-to-case (top) thermal resistance

50.3

°C/W

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

7.5

°C/W

Junction-to-board characterization parameter

62.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

7.6 Power Dissipation

PARAMETER

Description

TEST CONDITIONS

VALUE

UNIT

maximum signaling rate, THVD1419

350

mW

290

mW

300

mW

maximum signaling rate, THVD1429

350

mW

290

mW

300

mW