TSDGLW

Taiwan Semiconductor

2

Version:C1706

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

52

°C/W

Junction-to-ambient thermal resistance

84

°C/W

Junction-to-case thermal resistance

54

°C/W

Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

0.86

0.95

V

0.90

1.00

V

0.72

0.90

V

0.77

1.00

V

diode

(2)

-

1

µA

-

50

µA

Junction capacitance

15

-

pF

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING

Standard

Test Type

Test Conditions

SYMBOL

CLASS

Value

Typical

AEC-Q101-001

Human body

model(contact mode)

C=100pF,R=1.5kΩ

Vc

H3B

≥8kV

N/A

IEC 61000-4-2

Contact mode

C=150pF,R=330Ω

4

≥8kV

20kV

Air-discharge mode

C=150pF,R=330Ω

4

≥15kV

25kV

ISO 10605

Contact mode

C=330pF,R=330Ω

L4

≥15kV

20kV

Air-discharge mode

C=330pF,R=330Ω

L4

≥25kV

25kV

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

TSDGLW

(Note 1)

H

RV

G

SOD-123W

3,000 / 7" Plastic reel

RQ

10,000 / 13" Paper reel

Note:

1. Whole series with green compound (halogen-free)

EXAMPLE

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

TSDGLWHRVG

TSDGLW

H

RV

G

AEC-Q101 qualified

Green compound