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UP6013PQAG 数据表(PDF) 11 Page - uPI Group Inc. |
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UP6013PQAG 数据表(HTML) 11 Page - uPI Group Inc. |
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11 / 12 page ![]() uP6013 Conceptual 11 uP6013-DS-C3200, Jun. 2016 www.upi-semi.com Package Information Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. VQFN4x4 - 24L 3.90 - 4.10 Pin 1 mark Bottom View - Exposed Pad 0.18 - 0.30 2.30 - 2.80 0.30 - 0.50 0.0 - 0.05 0.80 - 1.00 0.20 REF |
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