AL5809

Document number: DS36625 Rev. 5 - 2

4 of 16

www.diodes.com

December 2016

© Diodes Incorporated

AL5809

Package Thermal Data

Package

Thermal Resistance

Junction-to-Case

Thermal Resistance

Junction-to-Ambient

PowerDI123

27.15°C/W

148.61°C/W (Note 4)

0.68W

PowerDI123

17.81°C/W

81.39°C/W (Note 5)

1.24W

SOD-123

69.56°C/W

278.42°C/W (Note 6)

0.36W

Recommended Operating Conditions

Symbol

Parameter

Min

Max

Unit

“In” Voltage Range Relative to “Out” Pin

2.5

60

V

LED Current (Note 7)

15

150

mA

Operating Ambient Temperature Range (Note 8)

-40

+125

°C

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

In-Out Supply Voltage

-

2.5

-

60

V

(±5% for over temperature)

AL5809-15S1-7

AL5809-15P1-7

14.25

15

15.75

mA

AL5809-20S1-7

AL5809-20P1-7

19

20

21

AL5809-25S1-7

AL5809-25P1-7

23.75

25

26.25

AL5809-30S1-7

AL5809-30P1-7

28.5

30

31.5

AL5809-40S1-7

AL5809-40P1-7

38

40

42

AL5809-50S1-7

AL5809-50P1-7

47.5

50

52.5

AL5809-60P1-7

57

60

63

AL5809-90P1-7

85.5

90

94.5

AL5809-100P1-7

95

100

105

AL5809-120P1-7

114

120

126

AL5809-150P1-7

142.5

150

157.5

(Note 10)

-

1

-

%

Minimum Power Up Voltage

-

1.5

-

V

Minimum On pulse width

(Note 12, 13)

-

500

-

-

µS

Minimum Off pulse width

(Note 12, 13)

-

500

-

-

µS

Thermal Shutdown

Junction Temperature

(Note 14)

-

-

+165

-

°C

Thermal Shutdown Hysteresis

-

-

-

+30

-

°C

Notes:

4. Test condition for PowerDI-123: Device mounted on 25.4mm x 25.4mm FR-4 PCB (10mm x 10mm 1oz copper, minimum recommended pad layout on

top layer and thermal vias to bottom layer ground plane). For better thermal performance, larger copper pad for heat-sink is needed.

5. When mounted on 50.8mm x 50.8mm GETEK PCB with 25.4mm x 25.4mm copper pads.

6. Test condition for SOD-123: Device mounted on FR-4 PCB with 50.8mm x 50.8mm 2oz copper, minimum recommended pad layout on top layer and

thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed.

7. The LED operating current is determined by the AL5809 current option index XXX, AL5809-XXXS/P1-7.

8. The Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal

to +125°C.

9. All voltages unless otherwise stated are measured with respect to OUT pin.

11. Apply the power linearly to the chip until the device starts to turn on.

10% of its final value.

13. This parameter only guaranteed by design, not tested in production.

14. Ambient temperature at which OTP is triggered may vary depending on application, PCB layout and material used.