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HSMP-381F 数据表(PDF) 6 Page - Agilent(Hewlett-Packard)

部件名 HSMP-381F
功能描述  Surface Mount RF PIN Low Distortion Attenuator Diodes
PDF  9 Pages
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制造商  HP [Agilent(Hewlett-Packard)]
网页  http://www.home.agilent.com
标志 HP - Agilent(Hewlett-Packard)

HSMP-381F 数据表(HTML) 6 Page - Agilent(Hewlett-Packard)

  HSMP-381F Datasheet HTML 1Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 2Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 3Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 4Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 5Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 6Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 7Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 8Page - Agilent(Hewlett-Packard) HSMP-381F Datasheet HTML 9Page - Agilent(Hewlett-Packard)  
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6
Assembly Information
SOT-323 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-323 (SC-70)
package is shown in Figure 12
(dimensions are in inches). This
layout provides ample allowance
for package placement by auto-
mated assembly equipment
without adding parasitics that
could impair the performance.
0.026
0.035
0.07
0.016
Figure 12. PCB Pad Layout
(dimensions in inches).
SOT-23 PCB Footprint
0.037
0.95
0.037
0.95
0.079
2.0
0.031
0.8
DIMENSIONS IN
inches
mm
0.035
0.9
Figure 13. PCB Pad Layout.
TIME (seconds)
T
MAX
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
Figure 14. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-323/-23
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 14. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235
°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.



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