DA6285.002

11 November, 2010

2 (12)

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Note

Serial Bus Data Input

DA

150

141

Serial Bus Clock Input

CLK

369

141

Programming Input

PV

593

140

Power Supply Voltage

VDD

150

689

Power Supply Ground

VSS

369

689

CDAC Output

COUT

593

689

Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or left

floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component assembly

are recommended to be performed in ESD protected area.

Note: Pad coordinates measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Note

Supply Voltage

-0.3

6.0

V

Input Voltage

V

1)

Power Dissipation (max)

100

mW

Storage Temperature

-55

150

Latch-Up Current Limit

±100

mA

Note: Stresses beyond the values listed may cause a permanent damage to the device. The device may not

operate under these conditions, but it will not be destroyed.

Note: This is a CMOS device and therefore it should be handled carefully to avoid any damage by static

voltages (ESD).

Note 1: Not valid for programming pin PV

RECOMMENDED OPERATION CONDITIONS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Supply Voltage

2.5

2.8

5.5

V

Operating Temperature

-40

+85

ELECTRICAL CHARACTERISTICS

(recommended operation conditions)

Parameter

Symbol

Min

Typ

Max

Unit

Note

Operating Frequency

200

MHz

Capacitance Range

3.3

34.3

pF

1)

Supply Current

0.3

10

µ

A

2)

Note 1: Capacitance values are typical and may vary ± 25% due to the IC process variation. Capacitance range

guaranteed by design.