DA6240C.007

17 October, 2016

11 (13)

SOLDERING INFORMATION



For Lead-Free / Green QFN 2mm x 2mm x 0.5mm and 3mm x 3mm x 0.75mm

Resistance to Soldering Heat

According to RSH test IEC 68-2-58/20

Maximum Temperature

260

C

Maximum Number of Reflow Cycles

3

Reflow profile

Thermal profile parameters stated in IPC/JEDEC J-STD-020

should not be exceeded. http://www.jedec.org

Lead Finish

7.62 - 25.4 µm, Matte Tin

QFN 2x2x0.5 EMBOSSED TAPE SPECIFICATIONS

Orientation on tape

Dimension

Min/Max

Unit

A0

2.13 ±0.05

mm

B0

2.13 ±0.05

mm

D

1.50 ±0.1

mm

1.00 +0.25/-0.00

mm

E

1.75 ±0.10

mm

F

3.50 ±0.05

mm

K0

0.88 ±0.05

mm

P

4.00 ±0.10

mm

P0

4.00 ±0.10

mm

10P0

40.00 ±0.20

mm

2.00

±0.05

mm

t

0.254

±0.02

mm

W

8.00 +0.3/-0.1

mm



5 MAX

°

Reel Material: Conductive, Plastic Antistatic or Static Dissipative

Carrier Tape Material: Conductive

Cover Tape Material: Static Dissipative

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