Datasheet

BMP280 Digital Pressure Sensor

Page 5

BST-BMP280-DS001-19 | Revision 1.19 | January 2018

Bosch Sensortec

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third

parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice. Not intended for publication.

5. DIGITAL INTERFACES............................................................................................................28

5.1 INTERFACE SELECTION...................................................................................................... 28

5.2 I²C INTERFACE.................................................................................................................. 28

5.2.1 I²C WRITE .................................................................................................................................... 29

5.2.2 I²C READ ..................................................................................................................................... 29

5.3 SPI INTERFACE................................................................................................................. 30

5.3.1 SPI WRITE ................................................................................................................................... 31

5.3.2 SPI READ .................................................................................................................................... 31

5.4 INTERFACE PARAMETER SPECIFICATION ............................................................................. 32

5.4.1 GENERAL INTERFACE PARAMETERS............................................................................................... 32

5.4.2 I²C TIMINGS ................................................................................................................................. 32

5.4.3 SPI TIMINGS ................................................................................................................................ 33

6. PIN-OUT AND CONNECTION DIAGRAM...............................................................................35

6.1 PIN-OUT ........................................................................................................................... 35

6.2 CONNECTION DIAGRAM 4-WIRE SPI ................................................................................... 36

6.3 CONNECTION DIAGRAM 3-WIRE SPI ................................................................................... 37

6.4 CONNECTION DIAGRAM I2C................................................................................................ 38

7. PACKAGE, REEL AND ENVIRONMENT................................................................................39

7.1 OUTLINE DIMENSIONS ....................................................................................................... 39

7.2 LANDING PATTERN RECOMMENDATION ............................................................................... 40

7.3 MARKING.......................................................................................................................... 41

7.3.1 MASS PRODUCTION DEVICES ........................................................................................................ 41

7.3.2 ENGINEERING SAMPLES................................................................................................................ 41

7.4 SOLDERING GUIDELINES.................................................................................................... 42

7.5 TAPE AND REEL SPECIFICATION ......................................................................................... 43

7.5.1 DIMENSIONS ................................................................................................................................ 43

7.5.2 ORIENTATION WITHIN THE REEL..................................................................................................... 43

7.6 MOUNTING AND ASSEMBLY RECOMMENDATIONS ................................................................. 44

7.7 ENVIRONMENTAL SAFETY .................................................................................................. 44

7.7.1 ROHS ......................................................................................................................................... 44

7.7.2 HALOGEN CONTENT ..................................................................................................................... 44

7.7.3 INTERNAL PACKAGE STRUCTURE ................................................................................................... 44

8. APPENDIX 1: COMPUTATION FORMULAE FOR 32 BIT SYSTEMS ..................................44

8.1 COMPENSATION FORMULA IN FLOATING POINT .................................................................... 44

8.2 COMPENSATION FORMULA IN 32 BIT FIXED POINT ................................................................ 45

9. LEGAL DISCLAIMER...............................................................................................................47

9.1 ENGINEERING SAMPLES .................................................................................................... 47