FENG-JUI TECHNOLOGY CO., LTD

HIGH CURRENT INDUCTOR-RoHS

Your Perfect Inductor

Rev.1701

GENERAL CHARACTERISTICS

1.

Operating temperature range: -55 TO + 125℃(Includes temperature when the coil is heated)

2.

High temperature exposure(storage) refer MIL-STD-202 Method 108: 1000 hrs at rated operating

temperature(e.g. 125℃). Part can be stored for 1000 hrs @125℃. Unpowered. Measurement at 24±4 hours

after test conclusion.

3.

Temperature cycling refer JESD22 Method JA-104: 1000 cycles(-55 TO + 125℃). Measurement at 24±4 hours

after test conclusion. 30 min maximum dwell time at each temp. extreme. 1 min. maximum transition time.

4.

Biased Humidity refer MIL-STD-202 Method 103: 1000 hours 85℃/85%RH. Unpowered. Measurement at

24±4 hours after test conclusion.

5.

Operational Life refer MIL-PRF-27: 1000 hrs. at 125 ℃ tested. Measurement at 24±4 hours after test

conclusion.

6.

External Visual refer MIL-STD-883 Method 2009: Inspect device construction, marking and workmanship.

7.

Physical Dimension refer JESD22 Method JB-100: Verify physical dimensions to the applicable device detail

specification.

8.

Resistance to Solvents refer MIL-STD-202 Method 215: Add aqueous wash chemical - OKEM clean or

equivalent.

9.

Mechanical Shock refer MIL-STD-202 Method 213: Figure 1 of Method 213. Condition C.

10. Vibration refer MIL-STD-202 Method 204: 5g;s for 20 minutes, 12 cycles each of 3 orientations. Test from

10-2000 Hz.

11. Resistance to soldering Heat refer MIL-STD-202 Method 210: Condition B No pre-heat of samples. Single

wave solder-procedure 2 for SMD and procedure 1 for leaded with solder within 1.5mm of device body.

12. ESD refer AEC-Q200-002 or ISO/DIS 10605: Direct contact discharge 2kV.

13. Solderability refer J-STD-002: For both Leaded & SMD. Magnification 50X. Conditions: Leaded, Method

A@235℃,category 3 ; SMD, a)Method B, 4hrs@155℃ dry heat @235℃, b)Method B@215℃ category 3.,

c)Method D category 3@260℃

14. Electrical Characterization refer spec: Show Min, Max Mean and Standard deviation at room from Min and Max

temperature.

15. Flammability refer UL-94: V-0 or V-1 Acceptable.

16. Board Flex refer AEC-Q200-005: 60 sec minimum holding time.

17. Terminal Strength(SMD) refer AEC-Q200-006

18. Reflow profile recommend:

1 0

60

300

250

200

150

100

50

0

T( ℃ )

T (s

300

24 0

18 0

1 20

60

0

L ea d -f r ee h e a t en d u r a n ce t es t

2 45 ℃ P e a k

230 ℃

40

1 7 0 ± 10℃ ,6 0-120 S

30 0

25 0

20 0

15 0

10 0

50

0

T (s )

300

24 0

18 0

12 0

60

0

L e a d -f r ee th e r ec o m m e n d ed r ef lo w c o n d it io n