Fast, refined and innovative

FULLY AUTOMATIC DICING MACHINE

Tokyo Seimitsu has introduced Japan’ s first Wafer Dicing Machine,

Model A-WA-75A in 1970 and tremendous contribution was made to

success of Semiconductor industry with die separation process

technology and its long term evolution with precession processing.

Vast resource accumulated on Dicing Technology over four decades

has enabled us to introduce next generation of Dicing machine, Model

AD2000T with latest technology in FLUIDIC ENGINEERING,

MECHATRONICS ENGINEERING and ENERGY CONSERVATION to

lead the world with Dicing technology.

Minimized X-axis

movement

Delivering fast X-axis (Up to 1,000 mm/sec) and

Y-axis (Up to 300 mm/sec) processing speed.

Low Cost of ownership.

Achieved smallest footprint possible utilizing our

own core technology.

Tokyo Seimitsu was the first to Introduce TWIN

Dicing Machine equipped with GUI and now refined

GUI is available with HELP function as a standard

feature for ease of operation.

World's smallest Dicing Machine

World's most efficient Dicing Machine

Introducing refined Graphic User Interface

Ease of maintenance

Widen front access door help improve routine

maintenance with ease-of-maintenance in mind.

TWIN Dicing concept with

two opposing Spindles

AD2000T_English

210*297 mm

TOKYO SEIMITSU