INMP401

SOLDERING PROFILE

Figure 1. Recommended Soldering Profile Limits

TABLE 3. RECOMMENDED SOLDERING PROFILE*

PROFILE FEATURE

Sn63/Pb37

Pb-Free

1.25°C/sec max

1.25°C/sec max

Preheat

Minimum Temperature

100°C

100°C

Minimum Temperature

150°C

20

0°C

60 sec to 75 sec

60 sec to 75 sec

1.25°C/sec

1.25°C/sec

45 sec to 75 sec

~50 sec

183°C

217°C

215°C +3°C/−3°C

245

°C +0°C/−5°C

Time Within +5°C of Actual Peak

20 sec to 30 sec

20 sec to 30 sec

Ramp-Down Rate

3°C/sec max

3°C/sec max

5 min max

5 min max

Note: *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All

microphones are also compatible with the J-STD-020 profile.

PREHEAT

CRITICAL ZONE

TIME

RAMP-DOWN

RAMP-UP

Page 5 of 14

Document Number: DS-INMP401-00

Revision: 1.0.