16% reduced footprint

The DFD6561 is equipped with a newly developed short spindle and an

optimized bridge-type frame structure resulting in a 16% reduced

footprint.

All maintenance can be performed from the front of the equipment, thus

reducing the area needed for installation and maintenance areas by 20%

(compared to the DFD6362). The DFD6561 is particularly ideal when

installing multiple adjacent units.

Intuitive operation

The LCD panel allows touch operation of the alignment teach function.

Important data, such as the equipment condition and mean time

between assists (MTBA) is also displayed on screen, allowing the

operator to easily confirm the status of the equipment. Onscreen error

recovery assistance is also available.

DFD6561

A space-saving solution for ø300 mm dicing

Fully Automatic Dicing Saw

Thorough options for particle prevention

Users can select optional particle prevention measures used in other

models, such as the cut section atomizing nozzle and spinner atomizing

nozzle. A chuck table water curtain, which prevents particle adhesion

caused by wafer drying, is also available.

Concentrated maintenance area

All operations, from routine to maintenance, can be performed from the front

of the equipment. The space reduction achieved in the DFD6561 allows 5

units to be lined up in a space which would only fit 4 units for the DFD6362

at a production facility.

New high-rigidity spindle

Equipped with a new high-rigidity spindle to achieve even higher processing

stability.

Newly developed non-contact setup

Equipped with a newly developed non-contact setup which measures the

blade wear amount with high accuracy and speed.

Synchronized dicing axis (X, Y, and Z) control

Measures the height of the chuck table to which the wafer will be secured in

advance and controls the blade cutting depth with high accuracy (user-

specified).