Surface Planer

DFS8910/8960

DAS8920/8930

DFS8910/8960, DAS8920/8930 Specifications

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1 ppm. Filtration rating: 0.01 μm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• Keep cutting water 2 ℃ above room temperature (fluctuations within 1 ℃ over one hour).

• Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

* The above specifications may change due to technical modifications. Please confirm when placing your order.

* For further information please contact your local sales representatives.

* When using any substance other than deionized water, please contact your local representatives.

2015.12

[Processing example 2] LED phosphor resin planarization

Variations in resin thickness of the LED emission unit is the cause of color

irregularities. Planarization of the resin and bumps with high accuracy using a

diamond bit can contribute towards the stabilization of LED color emissions.

The even surface thickness results

in uniform LED color distribution

[Processing example 3] Protective tape planarization

Backgrinding of wafers with large bumps can result in high wafer thickness variation.

The final wafer surface thickness variation can be reduced by tape planarization prior to grinding.

DFS8910

DFS8960

DAS8920

DAS8930

Wafer diameter

-

ø8*

ø300/200 mm

ø8

ø300 mm

Number of spindles

-

12

11

Number of chuck tables

-

12

11

Transport/Cleaning

-

-

With

With

Without

Without

Process precision

TTV

μm

Less than 2.0

Less than 3.0

Less than 2.0

Less than 3.0

surface roughness

μm

Within Ra 0.02

Within Ra 0.02

Within Ra 0.02

Within Ra 0.02

Utilities

Machine dimensions (W × D × H)

mm

1,200 X 2,670 X 1,800

1,400X3,312X1,870

500 X 1,235 X 1,800

730 X 1,570 X 1,800

Machine weight

kg

Approx. 2,400

Approx.5,000

Approx. 800

Approx. 1,600

* For customers who would like to process workpieces greater than ø8" in diameter, please contact your local DISCO sales representative.

www.disco.co.jp