INMP510

OUTLINE DIMENSIONS

Figure 13. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV]

3.35 × 2.50 × 0.98 mm Body

Dimensions shown in millimeters

Figure 14. Package Marking Specification (Top View)

ORDERING GUIDE

PART

TEMP RANGE

PACKAGE

QUANTITY

−40°C to +85°C 3-Terminal LGA_CAV

10,000

−40°C to +85°C 3-Terminal LGA_CAV

1,000

EV_INMP510-FX

—

Flexible Evaluation Board

—

* – 13” Tape and Reel

† – 7” Tape and reel is discontinued. Contact sales@invensense.com for availability.

REVISION HISTORY

REVISION DATE

REVISION

DESCRIPTION

02/06/14

1.0

Initial Release

2.575

2.500

2.425

3.425

3.350

3.275

TOP VIEW

SIDE VIEW

REFERENCE

CORNER

1.08

0.98

0.88

2.21

REF

3.06 REF

BOTTOM VIEW

1.08

0.95 DIA.

0.25 NOM

0.20 MIN

DIA.

THRU HOLE

(SOUND PORT)

1.22 BSC

1.25

0.54

REF

0.64 REF

1.55 DIA.

1.52

BSC

1.07

REF

0.75 REF

2

1

3

0.90 × 0.68

(PINS 1, 3)

0.20 TYP

× 45°

0.30 BSC

PIN 1

510

YYXXX

PIN 1 INDICATION

LOT TRACEABILITY

DATE CODE

PART NUMBER

Page 12 of 13

Document Number: DS-INMP510-00

Revision: 1.0.