M50FLW080BK5TP datasheet(51/64 Pages) STMICROELECTRONICS

51 / 64 page

M50FLW080A, M50FLW080B

Part numbering

51/64

Part numbering

Devices are shipped from the factory with the memory content bits erased to ’1’.

For a list of available options (Speed, Package, etc.) or for further information on any aspect

of this device, please contact the ST Sales Office nearest to you.

The category of second-Level Interconnect is marked on the package and on the inner box

label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on the inner box label.

Table 33.

Ordering information scheme

Example:

M50FLW080

Device Type

M50 = Flash Memory for PC BIOS

Architecture

FL = Firmware Hub/Low Pin Count Interface

Operating Voltage

W = VCC = 3.0 to 3.6V

Device Function

080 = 8 Mbit (x8), Uniform Blocks and Sectors

Array Matrix

A = 2 x 16 x 4KByte top sectors + 1 x 16 x 4KByte bottom sectors

B = 1 x 16 x 4KByte top sectors + 2 x 16 x 4KByte bottom sectors

Package

K = PLCC32

NB = TSOP32: 8 x 14mm(1)

The TSOP32 package is only available in devices of the A type array matrix.

N = TSOP40: 10 x 20mm(2)

Devices delivered in this package are Not Recommended for New Design.

Device Grade

5 = Temperature range –20 to 85 °C.

Device tested with standard test flow

Option

blank = Standard Packing

T = Tape and Reel Packing

Plating Technology

P or G = ECOPACK® (RoHs compliant)

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