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FP1007R2-R30-R 数据表(PDF) 5 Page - Eaton All Rights Reserved.

部件名 FP1007R2-R30-R
功能描述  High frequency, high current power inductors
PDF  5 Pages
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制造商  EATON [Eaton All Rights Reserved.]
网页  https://www.eaton.com
标志 EATON - Eaton All Rights Reserved.

FP1007R2-R30-R 数据表(HTML) 5 Page - Eaton All Rights Reserved.

  FP1007R2-R30-R Datasheet HTML 1Page - Eaton All Rights Reserved. FP1007R2-R30-R Datasheet HTML 2Page - Eaton All Rights Reserved. FP1007R2-R30-R Datasheet HTML 3Page - Eaton All Rights Reserved. FP1007R2-R30-R Datasheet HTML 4Page - Eaton All Rights Reserved. FP1007R2-R30-R Datasheet HTML 5Page - Eaton All Rights Reserved.  
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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4341 BU-10927
October 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Technical Data
4341
Effective October 2015
FP1007
High frequency, high current power inductors
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin)
100°C
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
60-120 Seconds
60-120 Seconds
Average ramp up rate Tsmax to Tp
3°C/ Second Max.
3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)*
Table 1
Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)
20 Seconds**
30 Seconds**
Average ramp-down rate (Tp to Tsmax)
6°C/ Second Max.
6°C/ Second Max.
Time 25°C to Peak Temperature
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
t
tP
ts
TC -5°C
Time 25°C to Peak
Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
235°C
220°C
≥2.5mm
220°C
220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm
260°C
260°C
260°C
1.6 – 2.5mm
260°C
250°C
245°C
>2.5mm
250°C
245°C
245°C



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