2

Technical Data

10476

Effective November 2015

FP1108B

High frequency, high current power inductors

www.eaton.com/elx

Product specifications

(nH)±10%

(nH) minimum

I

rms

3

(amps)

I

4

(amps)

I

5

(amps)

I

6

(amps)

DCR (mΩ)

±5% @ 20°C

B1 version

FP1108B1-R180-R

180

130

40

63

55

50

0.29

349

1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C

2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I

3. I

for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-

ing components will affect the temperature rise. It is recommended that the temperature of the part

not exceed 125°C under worst case operating conditions verified in the end application.

4. I

5. I

6. I

7. K-factor: Used to determine B

B

-3

. B

L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).

8. Part Number Definition: FP1108Bx-Rxxx-R

FP1108B= Product code and size

x= Version indicator

Rxxx= Inductance value in μH, R= decimal point

-R suffix = RoHS compliant

Dimensions (mm)

Part marking: FP1108Bx (Product code and size, x = version indicator),

Rxxx = Inductance value in uH, R = decimal point

wwllyy = date code, R = revision level

All soldering surface to be coplanar within 0.10mm

DCR measured between point “a” and point “b”

Recommended Pad Layout

Schematic