2

Technical Data 10465

Effective January 2018

FP1109B

High frequency, high current power inductors

www.eaton.com/electronics

Product specifications

(nH)±10%

(nH) minimum

I

rms

3

(A)

I

4

(A)

I

5

(A)

DCR (mΩ)

@ +20 °C ±5%

FP1109B1-R150-R

150

108

55

80

64

0.19

339

FP1109B1-R180-R

180

130

55

62

49

0.19

339

FP1109B1-R220-R

220

158

55

50

40

0.19

339

FP1109B1-R300-R

300

216

55

38

30

0.19

339

1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 ºC

2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, I

3. I

for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-

ing components will affect the temperature rise. It is recommended that the temperature of the part

not exceed +125 °C under worst case operating conditions verified in the end applicat ion.

4. I

5. I

6. K-factor: Used to determine B

B

-3

. B

L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).

7. Part Number Definition: FP1109Bx-Rxxx-R

FP1109B= Product code and size

x= version indicator

Rxxx= Inductance value in μH, R= decimal point

-R suffix = RoHS compliant

Dimensions (mm)

Part marking: FP1109Bx (Product code and size, x = version indicator),

Rxxx = Inducutance value in uh, R = decimal point

wwllyy = date code, R = revision level

All soldering surface to be coplanar within 0.10 mm

Pad layout tolerances are ±0.1 millimeters unless stated otherwise

DCR measured between point “a” and point “b”