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1025HC25-R 数据表(PDF) 8 Page - Eaton All Rights Reserved. |
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1025HC25-R 数据表(HTML) 8 Page - Eaton All Rights Reserved. |
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8 / 9 page ![]() 8 Technical Data 10572 Effective June 2017 1025HC Fast-acting, high current, surface mount ceramic tube fuses www.eaton.com/electronics Wave solder profile Reference EN 61760-1:2006 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat • Temperature min. (Tsmin) 100 °C 100 °C • Temperature typ. (Tstyp) 120 °C 120 °C • Temperature max. (Tsmax) 130 °C 130 °C • Time (Tsmin to Tsmax) (ts) 70 seconds 70 seconds D preheat to max Temperature 150 °C max. 150 °C max. Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C Time at peak temperature (tp) 10 seconds max 5 seconds max each wave 10 seconds max 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~3.5 K/s typ ~5 K/s max ~ 2 K/s min ~3.5 K/s typ ~5 K/s max Time 25 °C to 25 °C 4 minutes 4 minutes Manual solder 350 °C, 4-5 seconds (by soldering iron), generally manual, hand soldering is not recommended. Time Tsmin Tsmax Tstyp Tp tp First Wave Second Wave Preheat area Cool down area |
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