5

Technical Data

4326

Effective December 2015

6125FF

Fast-acting subminiature fuses

www.eaton.com/elx

t

Time 25°C to Peak

Time

25°C

Preheat

A

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Solder Reflow Profile

Reference JDEC J-STD-020D

Profile Feature

Standard SnPb Solder

Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (Tsmin)

100°C

150°C

• Temperature max. (Tsmax)

150°C

200°C

• Time (Tsmin to Tsmax) (ts)

60-120 Seconds

60-120 Seconds

Average ramp up rate Tsmax to Tp

3°C/ Second Max.

3°C/ Second Max.

Time at liquidous (tL)

183°C

60-150 Seconds

217°C

60-150 Seconds

Peak package body temperature (TP)*

Table 1

Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)

20 Seconds**

30 Seconds**

Average ramp-down rate (Tp to Tsmax)

6°C/ Second Max.

6°C/ Second Max.

Time 25°C to Peak Temperature

6 Minutes Max.

8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1 - Standard SnPb Solder (Tc)

Package

Thickness

Volume

mm3

<350

Volume

mm3

≥350

<2.5mm)

235°C

220°C

≥2.5mm

220°C

220°C

Table 2 - Lead (Pb) Free Solder (Tc)

Package

Thickness

Volume

<350

Volume

350 - 2000

Volume

>2000

<1.6mm

260°C

260°C

260°C

1.6 – 2.5mm

260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C