AW8155 datasheet(4/23 Pages) AWINIC

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AW8155

July 2018 V1.1

www.awinic.com.cn

ORDERING INFORMATION

Part Number

Temperature

Package

Marking

Moisture

Sensitivity

Level

Environ-

mental

Information

Packing

Type

AW8155FCR

-40℃～85℃

FCQFN

1.5*1.5-9L

A55

MSL3

ROHS+HF

3000

units/Tape

and Reel

AW8155

Shipping

R: Tape & Reel

Package Type

FC: FCQFN

ABSOLUTE MAXIMUM RATINGS(1)

Parameter

Unit

Supply voltage VDD

-0.3V to 6V

Input Voltage

-0.3V to VDD+0.3V

Package Thermal Resistance

JA(2)

℃/W

Operating free-air temperature

-40

℃ to 85℃

Maximum Junction Temperature TJMAX

125

℃

Storage Temperature Range TSTG

-65

℃ to 150℃

Lead Temperature (Soldering 10 Seconds)

260

℃

ESD Rating(3)

HBM(human body model)

±8KV

Latch-up

Test Condition :JEDEC STANDARD NO.78B DECEMBER 2008

+IT:450mA

-IT:-450mA

note1:

Stresses beyond those listed under "absolute

maximum ratings" may cause permanent damage to the

device. These are stress ratings only and functional oper-

ation of the device at these or any other conditions beyond

those indicated under "recommended operating condi-

tions" is not implied. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliabil-

ity.

note2:

For the 9-Pin Flip-Chip CSP package, the

θJA is

highly dependent of the PCB Heatsink area. For example,

θJA can equal 195°C/W with 50 mm2 total area and also

135°C/W with 500 mm2. When using ground and power

planes, the value is around 90°C/W, as specified in table

note3:

The human body model is a 100pF capacitor

discharged through a 1.5kΩ resistor into each pin. Test

method: MIL-STD-883G Method 3015.7.

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