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GD25B32CSIG 数据表(PDF) 32 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25B32CSIG 数据表(HTML) 32 Page - GigaDevice Semiconductor (Beijing) Inc. |
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32 / 56 page ![]() 3.3V Uniform Sector Dual and Quad Serial Flash GD25B32C 32 Command 0 1 2 3 4 5 6 7 ABH CS# SCLK SI 8 9 29 30 31 MSB 2 1 0 3 Dummy Bytes 23 22 32 33 34 35 36 37 38 7 6 5 4 3 2 1 0 SO MSB t RES2 Stand-by Mode Deep Power-down Mode High-Z Device ID Figure 26. Release Power-Down/Read Device ID Sequence Diagram 7.23. Read Manufacture ID/ Device ID (REMS) (90H) The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID. The command is initiated by driving the CS# pin low and shifting the command code “90H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in Figure27. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Figure 27. Read Manufacture ID/ Device ID Sequence Diagram Command 0 1 2 3 4 5 6 7 90H CS# SCLK SI SO High-Z 8 9 10 28 29 30 31 3 2 1 0 23 22 21 24-bit address MSB 34 35 36 37 33 6 5 4 3 2 1 0 38 39 32 42 43 44 45 41 46 47 40 7 Device ID CS# SCLK SI SO MSB Manufacturer ID 6 5 4 3 2 1 0 7 |
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