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GD25B64CSIG 数据表(PDF) 32 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25B64CSIG 数据表(HTML) 32 Page - GigaDevice Semiconductor (Beijing) Inc. |
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32 / 57 page ![]() 3.3V Uniform Sector Dual and Quad Serial Flash GD25B64C 32 Command 0 1 2 3 4 5 6 7 ABH CS# SCLK SI 8 9 29 30 31 MSB 2 1 0 3 Dummy Bytes 23 22 32 33 34 35 36 37 38 7 6 5 4 3 2 1 0 SO MSB t RES2 Stand-by Mode Deep Power-down Mode High-Z Device ID Figure 26. Release Power-Down/Read Device ID Sequence Diagram 7.23. Read Manufacture ID/ Device ID (REMS) (90H) The Read Manufacturer/Device ID command is an alternative to the Release from Power-Down / Device ID command that provides both the JEDEC assigned Manufacturer ID and the specific Device ID. The command is initiated by driving the CS# pin low and shifting the command code “90H” followed by a 24-bit address (A23-A0) of 000000H. After which, the Manufacturer ID and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown below. If the 24-bit address is initially set to 000001H, the Device ID will be read first. Figure 27. Read Manufacture ID/ Device ID Sequence Diagram Command 0 1 2 3 4 5 6 7 90H CS# SCLK SI SO High-Z 8 9 10 28 29 30 31 3 2 1 0 23 22 21 24-bit address MSB 34 35 36 37 33 6 5 4 3 2 1 0 38 39 32 42 43 44 45 41 46 47 40 7 Device ID CS# SCLK SI SO MSB Manufacturer ID 6 5 4 3 2 1 0 7 |
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