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24LC32AT-I/MS 数据表(PDF) 13 Page - Microchip Technology |
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24LC32AT-I/MS 数据表(HTML) 13 Page - Microchip Technology |
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13 / 26 page ![]() 2003 Microchip Technology Inc. DS21713D-page 13 24AA32A/24LC32A 8.0 PACKAGING INFORMATION 8.1 Package Marking Information XXXXXXXX T/XXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX T/XXYYWW NNN 8-Lead TSSOP Example: 24LC32A I/P13F 0327 24LC32A I/SN0327 13F 4LA I327 13F 8-Lead MSOP Example: XXXXXT YWWNNN 4L32AI 32713F 8-Lead SOIC (208 mil) Example: XXXXXXXX T/XXXXXX YYWWNNN 24LC32A I/SM 032713F Legend: XX...X Customer specific information* T Temperature grade (I, E) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. *Standard QTP marking consists of Microchip part number, year code, week code, and traceability code. Device TSSOP Marking Codes STD Rot Pb-free Rot 24AA32A 4AA 4AAX G4AA G4AAX 24LC32A 4LA 4LAX G4LA G4LAX Device MSOP Marking Codes STD Pb-free 24AA32A 4A32 G4AA 24LC32A 4L32A G4LA Note: Pb-free part number using “G” suffix is marked on carton XXXX TYWW NNN |
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