NICHIA STS-DA1-5625 <Cat.No.190328>

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CAUTIONS

(1) Storage

Conditions

Temperature

Humidity

Time

Storage

Before Opening Aluminum Bag

≤30°C

≤90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag

≤30°C

≤70%RH

≤168hours

Baking

65±5°C

-

≥24hours

● The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 or equivalent.

Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED.

● This LED uses a package that could absorb moisture; if the package absorbs moisture and is exposed to heat during soldering, it

may cause the moisture to vaporize and the package to expand and the resulting pressure may cause internal delamination. This

may cause the optical characteristics to degrade. To minimize moisture absorption in storage/transit, moisture-proof aluminum

bags are used for the LEDs with a silica gel packet to absorb any air moisture in the bag. The silica gel beads turn blue to red as

they absorb moisture.

● Once the moisture-proof aluminum bag is open, ensure that the LED is soldered to a PCB within the range of the conditions above.

To store any remaining unused LEDs, use a hermetically sealed container with silica gel desiccants. Nichia recommends placing

them back to the original moisture-proof bag and reseal it.

● If the “After Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before

use. Baking should only be done once.

● This LED has silver-plated parts both inside and outside of the package. If the LEDs are exposed to a corrosive environment, it may

cause the plated surface to tarnish causing issues (i.e. solderability, optical characteristics). Ensure that when storing LEDs, a

hermetically sealed container is used. Nichia recommends placing them back to the original moisture-proof bag and reseal it.

● Ensure that when designing, there are no issues with the parts/materials used with the LEDs. The following must be taken into

consideration:

- After soldering LEDs to a PCB and/or installing them in a system, it is possible that the LEDs will be exposed to corrosive

gases released from parts/materials used with the LEDs in the same assembly/system (e.g. rubber materials, cardboard

boxes) and/or gases entering from the outside; the plated surface may tarnish depending on the gas component.

- Small amounts of corrosive gas may be found in the air.

- Resin materials may contain substances (e.g. halogens) that affect the plated surfaces of the LEDs.

● To prevent substances/gases from affecting the plated surface, ensure that the parts/materials used with the LEDs in the same

assembly/system do not contain sulfur (e.g. gasket/seal, adhesive, etc.). If the plating becomes extremely corroded or

contaminated, it may cause issues (e.g. electrical connection failures). If a gasket/seal is used, silicone rubber gaskets/seals are

recommended; ensure that this use of silicone does not result in issues (e.g. electrical connection failures) caused by low

molecular weight volatile siloxane.

● To avoid condensation, the LEDs must not be stored in areas where temperature and humidity fluctuate greatly.

● Do not store the LEDs in a dusty environment.

● Do not expose the LEDs to direct sunlight and/or an environment over a long period of time where the temperature is higher than

normal room temperature.