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ADA4945-1ACPZ-R2 数据表(PDF) 43 Page - Analog Devices |
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ADA4945-1ACPZ-R2 数据表(HTML) 43 Page - Analog Devices |
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43 / 44 page ![]() Data Sheet ADA4945-1 Rev. 0 | Page 43 of 44 LAYOUT, GROUNDING, AND BYPASSING As a high speed device, the ADA4945-1 is sensitive to the PCB environment in which it operates. Using the superior performance of the ADA4945-1 requires attention to the details of high speed PCB design. Ensure that signal routing is short and direct to avoid parasitic effects. Wherever complementary signals exist, provide a symmetrical layout to maximize balanced performance. When routing differential signals over a long distance, ensure that PCB traces are close together, and twist any differential wiring such that loop area is minimized. This configuration reduces radiated energy and makes the circuit less susceptible to interference. Bypass the power supply pins as near to the device as possible and directly to a nearby ground plane. Use high frequency ceramic chip capacitors. Use two parallel bypass capacitors (0.1 µF and 10 µF) for each supply. Place the 0.1 µF capacitor as near to the device as possible. Further away, provide low frequency bypassing using 10 µF tantalum capacitors from each supply to ground. The ground plane must be as continuous and unbroken as possible to provide a low impedance path for return currents to the supply. As such, the ground plane should be kept free of any signal traces or other interruptions. |
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