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ADM3066EARMZ-R7 数据表(PDF) 11 Page - Analog Devices

部件名 ADM3066EARMZ-R7
功能描述  IEC ESD Protected, 500 kbps/50 Mbps RS-485 Transceivers
PDF  28 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADM3066EARMZ-R7 数据表(HTML) 11 Page - Analog Devices

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Data Sheet
ADM3061E/ADM3062E/ADM3063E/ADM3065E/ADM3066E/ADM3067E/ADM3068E
Rev. F | Page 11 of 28
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
VCC to GND
6 V
VIO to GND
−0.3 V to +6 V
Digital Input and Output Voltage (DE, RE, DI,
and RO)
−0.3 V to
VIO1 + 0.3 V
Driver Output and Receiver Input Voltage
−9 V to +14 V
Operating Temperature Ranges
−40°C to +85°C
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Continuous Total Power Dissipation
8-Lead SOIC_N
0.225 W
8-Lead MSOP
0.151 W
10-Lead MSOP
0.151 W
10-Lead LFCSP
0.450 W
14-Lead SOIC_N
0.239 W
Maximum Junction Temperature (TJ)
150°C
Lead Temperature
Soldering (10 sec)
300°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
ESD on the Bus Pins (A, B, Y, Z)
IEC 61000-4-2 Contact Discharge
±12 kV
IEC 61000-4-2 Air Discharge
10 Positive and 10 Negative
Discharges
±12 kV
Three Positive or Three Negative
Discharges
±15 kV
ESD Human Body Model (HBM)
On the Bus Pins (A, B, Y, Z)
≥±30 kV
All Other Pins
±8 kV
1
VIO = VCC on the ADM3061E/ADM3063E/ADM3065E/ADM3067E.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC is the junction to case thermal resistance.
Table 6. Thermal Resistance
Package Type
θJA1
θJC1
Unit
R-8
110.88
58.63
°C/W
RM-8
165.69
49.61
°C/W
RM-10
165.69
49.61
°C/W
R-14
104.5
42.90
°C/W
CP-10-9
55.65
33.22
°C/W
1
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with no bias. See JEDEC JESD-51.
ESD CAUTION



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