ADPD2140W

Data Sheet

Rev. 0 | Page 4 of 10

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Voltage (Any Channel)

Forward

0.1 V

Reverse

8 V

Power Dissipation

8 mW

Storage Temperature

125°C

Junction Temperature

110°C

Solder Reflow Temperature (<10 sec)

260°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

2000 V

Charged Device Model (CDM)

1250 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

the junction to case thermal resistance.

Package Type

Unit

CP-8-17

64.70

8.80

°C/W

1

Test condition: the thermal impedance simulated values are based on a

JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD-51.

SOLDERING PROFILE

Figure 2 and Table 4 provide details about the recommended

soldering profile.

PREHEAT

CRITICAL ZONE

TIME

RAMP-DOWN

RAMP-UP

Figure 2. Recommended Soldering Profile

Profile Feature

Condition (Pb Free)

2°C/sec maximum

Preheat

150°C

200°C

60 sec to 120 sec

2°C/sec maximum

217°C

60 sec to 150 sec

260°C + (0°C/−5°C)

Time Within 5°C of Actual Peak

20 sec to 30 sec

Ramp Down Rate

3°C/sec maximum

Time from 25°C to Peak Temperature

8 minutes maximum

1

Based on JEDEC Standard J-STD-020D.1.

ESD CAUTION