HMC798ALC4

Data Sheet

Rev. 0 | Page 26 of 26

OUTLINE DIMENSIONS

12

0.50

BSC

2.50 REF

BOTTOM VIEW

TOP VIEW

1

24

7

13

18

19

6

0.36

0.30

0.24

EXPOSED

PAD

PIN 1

INDICATOR

4.05

3.90 SQ

3.75

3.10 BSC

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.60

2.50 SQ

2.40

PIN 1

0.32

BSC

0.08

BSC

SIDE VIEW

1.00

0.90

0.80

SEATING

PLANE

Figure 83. 24-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-24-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

HMC798ALC4

−40°C to +85°C

MSL3

24-Terminal Ceramic Leadless Chip Carrier [LCC]

E-24-1

HMC798ALC4TR

−40°C to +85°C

MSL3

24-Terminal Ceramic Leadless Chip Carrier [LCC]

E-24-1

HMC798ALC4TR-R5

−40°C to +85°C

MSL3

24-Terminal Ceramic Leadless Chip Carrier [LCC]

E-24-1

EV1HMC798ALC4

Evaluation PCB Assembly

1

All models are RoHS compliant parts.

2

The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.

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registered trademarks are the property of their respective owners.

D16785-0-6/18(0)