© 2017 Kingbright. All Rights Reserved. Spec No: DSAM6456 / 1201008407 Rev No: V.3B Date: 07/18/2017

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PACKING & LABEL SPECIFICATIONS

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

HANDLING PRECAUTIONS

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is

more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone

encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.

2. Do not directly touch or handle the silicone lens

surface. It may damage the internal circuitry.

1. Handle the component along the

side surfaces by using forceps or

appropriate tools.

4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.

4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure

precise pickup and avoid damage during production.

plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such

substances.

3. Do not stack together assembled

PCBs containing exposed LEDs.

Impact may scratch the silicone lens

or damage the internal circuitry.

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