www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

TYP

4X (0.25)

4X (0.4)

(0.25)

TYP

(R0.05) TYP

(0.6)

(0.8)

(0.4)

(0.2)

TYP

(0.027) TYP

(0.2) TYP

EXPOSED METAL

CLEARANCE

X2SON - 0.4 mm max height

DTQ0006A

PLASTIC SMALL OUTLINE - NO LEAD

4224056/A 11/2017

NOTES: (continued)

6. This package is designed to be soldered to a thermal pads on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

7. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SYMM

1

2

3

SYMM

4

5

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:50X

6

METAL UNDER

SOLDER MASK

TYP

TYP

SOLDER MASK OPEING