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存储条件

Storage condition

存贮环境条件

温度

Temperature

-10℃～+40℃

湿度

Humidity

≤

70%RH

期限

Term

≤

6 months (先进先出 First-in/ First-out)

地点

Place

1.不要暴露在下列环境条件下，否则将导致性能衰退或

参数漂移

Do not exposing the components to the following

conditions, otherwise, it may result in deterioration of

characteristics

2. 腐蚀性或易氧化气体Corrosive gas or deoxidizing

gas

3. 易燃易爆气体Flammable and explosive gases

4. 油、水和化学溶液Oil, water and chemical liquid

5. 太阳光下Under the sunlight

请不要在下列条件下使用本元件，否则将可能导致性能衰退或产品损毁，甚至引起

火灾。

Do not apply the components under the following conditions, otherwise, it may result

in deterioration of characteristics,destruction of components orin the worst case,to

catching fire

超过最大的工作电流

Exceeding Imax

超过许可工作温度范围

Exceeding rated temperature range

散热不良，由于散热不良，本元件可能因部分过热而导致破坏

Inferior thermal dissipation，Due to badly inferior thermal dissipation, some part of

the components body will become overheated and then be damaged

产品性能

properties of products

机械性能MECHANICAL CHARACTERISTICS

指标项目

Item

技术要求

Specification

测试条件/方法

Test Conditions & Methods

可焊性Solder-ability

浸润部分上锡均匀，上锡面积≥

95%

The terminals shall

beuniformly tinned, and its

area≥95%

将引出端沾助焊剂后，浸入到温度为240-245℃、深度为15mm 的锡

槽中锡面距NTC 本体下端6mm 处，持续2-3秒。（参见IEC68-2-20

/GB2423.28 试验Ta）

Dipping the NTC terminals to a depth of 15mm in a solderingbath

of 240-245℃ and to the place of 6mm far from NTCbody for2-3s

(See IEC68-2-20 /GB2423.28 Ta )

耐焊接热

Resistance To

Soldering Heat

无可见损伤

No visible mechanical

damage.ΔR/RN ≤20%

(ΔR =∣RN-RN'∣)

根据IEC68-2-20（GB2423 .28）试验Tb 进行试验。采用焊槽法，将

引出端沾助焊剂后，浸入到温度为265±5℃、深度为15mm 的锡槽中,

锡面距NTC 本体下端6mm处，维持10±1 秒. 在25±2℃条件下恢复4

－5h 后，复测额定零功率电阻RN'.

Dipping the NTC terminals to a depth of 15mm in a soldering

bath of 265±5℃ and to the place for 6mm below from NTC body

for 10±1s.After recovering4-5h under 25±2℃. The rated zero