5

Solder Reflow Temperature Profile

Recommended Lead Free IR Profile

217˚C

RAMP-DOWN

6˚C/SEC. MAX.

RAMP-UP

3˚C/SEC. MAX.

150 - 200˚C

260 +0/-5˚C

t 25˚C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5˚C of ACTUAL

PEAK TEMPERATURE

tp

t

s

PREHEAT

60 to 180 SEC.

t

L

T

L

T

smax

T

smin

25

T

p

TIME (SECONDS)

NOTES:

THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX.

UL

Approval under UL 1577,

component recognition program

File E55361.

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.

Regulatory Information

The HCPL-7860/HCPL-786J has been approved by the following organizations:

CSA

Approval under CSA Component

Acceptance Notice #5, File CA

88324.

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160˚C

140˚C

150˚C

PEAK

TEMP.

245˚C

PEAK

TEMP.

240˚C

PEAK

TEMP.

230˚C

SOLDERING

TIME

200˚C

PREHEATING TIME

150˚C, 90 + 30 SEC.

2.5˚C ± 0.5˚C/SEC.

3˚C + 1˚C/-0.5˚C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.

REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.